Infrared sensor metal package
can achieve large size optical window reliability brazing.
Multi-chip RF function module package
high package integration, convenient and reliable micro-assembly.
WSS package
large cavity, low cost
Power chip package
custom metal seal ring ceramic seal.
Width adjustment amplifier module package
stable and reliable glass melting sealing process.
Microwave power module package
it can be fully realized domestic replacement.
SOP system integration package
SOP is a new generation of SIP advanced packaging technology that can meet the needs of higher reliability applications
Accessories
Complete process technology platform integration capability
Go here to see our story
Professional technicians, first-class equipment technology
High reliability
miniaturization
Integrated
Committed to providing SOPsystem integrated packaging solutions and customized packaging products for customers with high reliability packaging requirements around the world
